SEMICON TOOLS offers a wide range of thickness', exposures, and grit selections to precisely suit your dicing requirements.

SEMICON TOOLS advanced propiertary manufacturing process enhances diamond exposure on both sides of the blade's cutting-edge giving you a smoother cut, less chipping, and a smaller kerf tolerance. It also results in less dressing and most important a longer lasting blade.

Our manufacturing process is so carefully monitored that each blade is guaranteed to be free of defects in materials and workmanship.

SEMICON TOOLS' other advantages...

• Absolute minimum blade flex while dressing or in production.
• Select thickness starting at .0006 in.
• Exposure selection from .010in to .100 in.

This 500x photograph shows the uniform concentration of diamonds which is identical throughout the blade.

· Hub Nickel Alloy Bonded Diamond Dicing Blades

· Hubless Nickel Alloy Diamond Dicing Blades

· Resin Diamond Blades

· What is the Correct Blade for Your Application?

· Blade Changing is Simple

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For additional information, please e-mail craig@ecsceramics.com.