BLADE PRECONDITIONING PROCEDURE

Our Dicing Blades are pre-dressed, therefore a long extensive procedure is not necessary. However, we recommend the following to retrue and condition every time it is first mounted on the saw spindle to improve the quality of cuts and to extend blade life.

Hub Blades - Can be dressed either dummy silicon wafer or dressing board.

In Silicon Wafer
4,5 or 9 Micron grit size blade, cut at fixed table speed = 10mm/sec (or 0.39"/sec) and according to chart below.

Z-index* Equivalent
Dept of Cut		 No. of cuts
0.012"
0.010"
0.008"
0.007"
0.006"
0.005"		 0.015"
0.017"
0.019"
0.020"
0.021"
cut thru		 10
10
10
10
10
10

* Based on wafer thickness = 0.021" mounted on top.

2 Micron grit size blade, cut as above but at fixed table speed = 5mm/sec (or 0.197"sec.)

Dressing Board
4,5 or 9 Micron grit size blade, cut according to chart below with depth of cut = blade length - 0.005"

Blade Thickness Feed Rate Feed Rate No. of cuts
mm/sec inch/sec
0.0006 - 0.001"
(0.015-0.025mm)		 5
10		 0.197
0.394		 2
2
above 0.001"
(0.025mm)		 10
19		 0.394
0.748		 2
2

2 Micron grit size blade, cut according to chart below with depth of cut = blade length - 0.005"

Blade Thickness Feed Rate Feed Rate No. of cuts
mm/sec inch/sec
All 3
5		 0.118
0.197		 2
2
Saw Specification:
Water Flow = 1.0 liter/min. Vacuum = 0.20 mmHg (2 CFM) Minimum
Air Pressure = 60-80 PSI Spindle Speed = 30,000 RPM
***WARNING*** Excessive blade dressing will produce faster blade wear and unpredictable results.
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For additional information, please e-mail craig@ecsceramics.com.